Specifications of LG-100 Series
LG-100 Series
Laser Gas Analyzer
Supporting advanced manufacturing processes for semiconductors through HORIBA’s unique built-in IRLAM infrared gas analysis technology
Laser Gas Analyzer LG-100 Series can take real-time measurements of partial pressure*1 changes in the silicon tetrafluoride (SiF4) produced during the etching process used in semiconductor manufacturing. These changes enable manufacturers to determine whether the etching has reached a permissible depth (endpoint*2). The LG-100 reduces the risk of under-etching and over-etching and contributes to higher productivity and yield when manufacturing semiconductors.
More sophisticated sensing technologies are necessary for advanced logic semiconductors. HORIBA STEC continues to broaden the multi-component gas analysis, improve response speed, and expand LG-100 functionality in other ways that contribute to greater productivity in the ever-evolving semiconductor manufacturing process to produce these state-of-the-art semiconductors. Going forward, we will continue to respond to diverse customer needs by expanding products with built-in IRLAM technologies.
*1 Pressure of each gas in a mixture
*2 Endpoint for the depth to engrave a wafer when etching a circuit
- High sensitivity/high speed measurement of exhaust gas components generated by etching processes
- Detect process endpoints by changes in gas composition
- For non-plasma applications
- IRLAM™ (Infrared Laser Absorption Modulation) is a next-generation infrared gas analysis technology originally developed by HORIBA in 2021. The LG-100 is equipped with IRLAM™, which realizes highly sensitive and fast (0.1 sec.) measurements of trace gases at a ppb level.
Click here for more information on IRLAM technology
*IRLAM is a registered trademark or trademark of HORIBA, Ltd
The etching process to engrave a circuit on a board using various gases demands precision control and measurement of those gases with the evolution to three-dimensional structures and refinement of modern semiconductor devices. That is why it has become even more important to stop the etching process at the optimal endpoint to increase yield. To address these types of etching needs, HORIBA STEC developed the LG-100 as a device that can measure partial gas pressure in real time during the etching process.
