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Semiconductors

Plating film thickness measurement of printed circuit board wiring

Wire plating film thickness measurement of tens of μm width

It is possible to perform non-destructive analysis of the multilayer film thickness of interconnects with a width of several tens of micrometers on the order of sub-micrometers.

Microscopic X-ray analyzer XGT-9000 Pro/Expert

Simple elemental analysis with no pre-treatment required and non-destructive
Introducing a new model equipped with an X-ray detector that can measure boron (B)
Quickly access measurement points with high-definition optical observation even in minute areas
A wide variety of image analysis software is also available.

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Related Applications

Fast analysis of microscopic metal particles is an important application for engineering (e.g. engine wear analysis). Micro-XRF scanning and spot analysis of specific fragments identifies their chemical composition.

Simultaneous imaging of transmission X-rays and fluorescent X-rays is effective to find defects inside electronic components.

We carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a HORIBA X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.

Our XGT-9000SL allows failure analysis at a microscopic level on a large sample, non-destructively, thanks to its large chamber capacity and its microprobes.

Semiconductor pattern - XGT-9000

The combination of microbeam and thickness measurement capability makes the XGT-9000 a useful tool for the QC of semiconductors, which feature thin and narrow patterns. Thickness sensitivity depends on elements traced, but can be at the Angstrom level.

μ-XRF is a non-destructive analytical technique which can inspect defects, even non-visible ones, inside a sample because of the high penetration of X-rays. This application note introduces failure analysis to detect ion migration, voids, and foreign matter on electronics using the XGT-9000, with key features of the vertical irradiation of a 10 μm probe and the simultaneous imaging of fluorescent X-rays and transmission X-rays.

Troubleshooting and defect analyses of components embedded within opaque resins are described, on both individual components and complete circuit boards. Quantitative analysis to the ppm level is ideally suited for ensuring compliance to the WEEE/RoHS directives.

The combination of the XGT-5000’s ground breaking spatial resolution and sensitivity means it is the instrument of choice for fast analysis of electronic components, whether for analysis of restricted harmful elements (the WEEE/RoHS ‘lead free’ legislation), trouble shooting, or R&D.

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Foreign material elemental analysis of defective parts on SiC wafers
- Identification of foreign elements that cause defects on SiC wafers
Foreign matter analysis on wafers in a wide range
- Analyzing foreign objects within a few square centimeters
Plating film thickness measurement of printed circuit board wiring
- Wire plating film thickness measurement of tens of μm width
Reticle/mask foreign object detection
- High-throughput foreign object detection
Foreign matter removal device on wafers
- Automatic foreign matter removal device using blow & vacuum suction