High Repeatability Particle Size Distribution Measurement of Colloidal Silica for CMP Slurries

Particle Characterization

Chemical Mechanical Polishing (CMP) technology is used as an essential fundamental technology in the manufacturing process of large scale semiconductor integrated circuits (LSI). Colloidal silica are widely used as CMP slurries because of their clean spherical shape created by the sol-gel method, which causes less polishing damage.

Since it is used for very precise polishing, its particle size is controlled with extremely high quality, and the particle size analyzer used for it must have high resolution and measurement repeatability. Colloidal silica was measured by Partica CENTRIFUGE, a centrifugal nanoparticle analyzer, and its measurement repeatability was confirmed.

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High Repeatability Particle Size Distribution Measurement of Colloidal Silica for CMP slurries

Since Colloidal Silica is used for very precise polishing, its particle size is controlled with extremely high quality. Partica CENTRIFUGE can easily perform measurement with high resolution and repeatability, which contributes to research and development and quality control of CMP slurry.

High Repeatability Particle Size Distribution Measurement of Colloidal Silica for CMP Slurries

Particle Characterization

Application Downloads

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