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United States
Semiconductors
Plating film thickness measurement of printed circuit board wiring
Wire plating film thickness measurement of tens of μm width
It is possible to perform non-destructive analysis of the multilayer film thickness of interconnects with a width of several tens of micrometers on the order of sub-micrometers.
Microscopic X-ray analyzer XGT-9000 Pro/Expert
Simple elemental analysis with no pre-treatment required and non-destructive
Introducing a new model equipped with an X-ray detector that can measure boron (B)
Quickly access measurement points with high-definition optical observation even in minute areas
A wide variety of image analysis software is also available.
