Micro-XRF analysis for metal debris and particle analysisFast analysis of microscopic metal particles is an important application for engineering (e.g. engine wear analysis). Micro-XRF scanning and spot analysis of specific fragments identifies their chemical composition.
Failure analysis, RoHS testing of ElectronicsSimultaneous imaging of transmission X-rays and fluorescent X-rays is effective to find defects inside electronic components.
Non-destructive thickness and composition analysis of NiP/Au plating on Cu contacts using micro-XRFWe carried out plating thickness and composition analysis on dual-layer NiP/Au plating on Cu contacts on a flexible printed circuit using a HORIBA X-ray analytical microscope. We successfully detected Au of ultra-thin layer without any sample preparation. The thickness results of Au and NiP plating were consistent with the provided values and with good repeatability.
Non-destructive failure analysis on a large printed circuit boardOur XGT-9000SL allows failure analysis at a microscopic level on a large sample, non-destructively, thanks to its large chamber capacity and its microprobes.
使用 XGT-9000 对电子元件进行无损故障分析是不可见的缺陷。本应用介绍了使用 XGT-9000 检测电子设备上的离子迁移、空隙和异物等故障分析，主要特点是10 μm X射线头垂直照射以及荧光 X 射线和透射 X 射线的同时成像
使用micro-XRF进行电子行业的质量控制和缺陷分析本应用展示了对嵌在不透明树脂中的组件故障排除和缺陷分析，包括单个组件和完整的电路板，此外ppm级别的定量分析还可以确定是否符合WEEE/RoHS 指令。
