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Foreign matter can cause various defects in electronic circuit boards, so it is important to identify the source. Using HORIBA's μXRF technology, it is possible to identify the elemental species of minute foreign particles and obtain data useful for identifying the source. μXRF can also measure the thickness of thin metal films, and can contribute to controlling the thickness of wiring on electronic boards with a width of several tens of micrometers.
Film Thickness and Quality | Elemental Analysis | Foreign Object Detection/Analysis
In the advancement of thin film technology through miniaturization, we propose solutions for achieving high film deposition control, such as in-situ evaluation during the film deposition process and evaluation of thin films at the Ångström order level.
Membrane information obtained using a spectroscopic ellipsometer
Defects in wafers can also be caused by foreign matter, and we will introduce a method of microscopic elemental analysis to identify the cause of defects.
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微区X射线荧光分析仪
超大样品室微区 X 射线荧光分析仪
研究级经典型椭偏仪
Reticle / Mask Particle Detection System
